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GasPlate High Temperature Gas Diffuser

  • Gasplate diffusers can be easily installed into vacuum systems. They are highly suitable for clean, rapid, and turbulence-reducing backfill processes. The result of using these diffusers is increased product yield and equipment throughput. When correctly installed and used under specified operating conditions, they can also maintain product integrity for up to 3,000,000 cycles. Gasplate diffusers are widely used in ventilation applications such as semiconductor equipment interfaces (CVD, PVD, Etch, Epi), loading lock chambers, transfer chambers, cooling chambers, and process chambers in other vacuum chambers. They are used in situations requiring the rapid transfer of large gas flows.

     

    Product Features

    •  Reducing turbulence during venting from the process cavity

    •  Suitable for a wide range of process gases

    •  Manufacturing, testing, and packaging in a dust-free room

    •  100% integrity tested

GasPlate High Temperature Gas Diffuser
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  • GasPlate High Temperature Gas Diffuser

Product Parameters

  • Maximum inlet pressure:207 Bar@23℃
    Maximum differential pressure:
    Forward: 4 bar (60 psid) @ 23°C (73 °F)
    反向: 0.07 MPa (0.7 bar, 10 psid) @ 23°C (73℉)
    Maximum operating temperature:120 ℃ (248 ℉)
    Gas flow rate:
    Recommended working flow rate: 0-60slpm

Typical Applications

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