Filtration & Separation Solutions
Embrace Ultimate Application Challenges of Filtration, Separation, and Purification Technology
Etching Gas Filtration
Dry etching technology is a process that removes materials from the wafer surface through physical or chemical means in a non-liquid environment. Major techniques include plasma etching and reactive ion etching (RIE), where the core principle is to use specific gases in a low-pressure plasma environment to react with materials, achieving precise pattern transfer. Compared to wet etching, dry etching offers higher precision, better directionality, and reduced chemical usage. As a critical material in semiconductor manufacturing, the performance of dry etching gases directly impacts the quality and performance of the final product, making it widely used in advanced semiconductor processes.
Common dry etching gases include fluorine-based gases, chlorine- and bromine-based gases, passivation gases, and auxiliary gases. Together, these gases enable the precise removal of material and pattern transfer on the wafer surface during etching.
Gas purity is essential to distinguish the material quality used in electronics manufacturing versus industrial applications. Any impurities directly contact semiconductor wafers or display glass, so gases used in semiconductor processes require a purity of 99.999% or higher. Feature-Tec provides high-performance ultrapure gas filters to remove tiny impurities from etching gases. For corrosive gases like chlorine, Feature-Tec’s MIGHTY-G perfluorinated ultrapure gas filter is highly resistant to high temperatures and strong corrosion, making it suitable for filtering bulk, oxidizing, and corrosive gases.
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